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Niobium Sputtering Targets

SIZEN provides high-purity niobium sputtering targets for touchscreens, semiconductors, Low-E glass, and anti-reflective (AR) coatings. Our targets are designed with a dense structure, uniform grain size, and controlled texture, ensuring smooth, consistent coatings and stable sputtering performance.

We offer planar and rotary niobium sputtering targets in a range of sizes to fit different applications. Common options include 8-inch (200 mm) and 12-inch (300 mm) round targets, with larger custom disc targets available up to 29 inches (737 mm) in diameter.

With high purity, precise dimensions, and reliable performance, SIZEN's niobium sputtering targets help create high-quality, long-lasting coatings for advanced industries. Contact us today for a quote or to request custom sizes!

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  • Material: Pure Niobium
  • Standards: ASTM B393-05
  • Grade: RO4200-1, RO4210-2
  • Purity: 99.9%, 99.95%, 99.99%, 99.995%
  • Diameter: <= 16 inch
  • Density: 8.57 g/cm³ @20°C
  • Melting Point: 2477 °C
  • Boiling Point: 4742°C
  • Thermal Conductivity: 0.537 W/cm/K @ 298.2 K
  • Electrical Resistivity: 12.5 microhm-cm @ 0 °C
Thickness (mm) Tolerance (mm) Diameter (mm) Diameter Tolerance (mm)
Grade I Grade II
3-8 ±0.1 ±0.2 50-450 ±0.2
8-14 ±0.1 ±0.2 50-450 ±0.2
≥14 ±0.1 ±0.2 50-400 ±0.2

 

Thickness (mm) Tolerance (mm) Width (mm) Width Tolerance (mm) Length (mm) Length Tolerance (mm)
Grade I Grade II
3-8 ±0.1 ±0.2 50-400 ±0.2 50-1800 ±0.2
8-14 ±0.1 ±0.2 50-350 ±0.2 50-1500 ±0.2
≥14 ±0.1 ±0.2 50-300 ±0.2 50-1200 ±0.2

High-Purity Niobium

99.95% pure niobium for minimal contamination

High Density Structure

95-99% density for efficient sputtering

Precision Machining

±0.1 mm tolerance and Ra 0.8–1.6 µm surface roughness.

Superior Surface Finish

Smooth, high-quality finish ensures purity and performance.

Real-World Testing

Tested in a PVD lab for reliable coating results.

5 MAIN REASONS TO CHOOSE US

Ultra-High Purity for Minimal Contamination

We select high-purity raw materials with extremely low impurity levels, reaching a minimum purity of 99.95%.

High-Density Structure for Superior Performance

SIZEN uses advanced melting and processing techniques to increase the density of our niobium sputtering targets to 95-99%, ensuring efficient sputtering, better film uniformity, and longer target lifespan.

Precision Machining for Accurate Fit

Our CNC machining center ensures each niobium sputtering target meets tight tolerances of ±0.1 mm, with a surface roughness of Ra 0.8–1.6 µm. This guarantees a perfect fit, stable sputtering rates, and consistent film thickness.

Superior Surface Finish

Our targets feature a highly refined surface with minimal impurities and defects, ensuring excellent material purity and consistent results in high-precision applications.

Real-World Testing for Reliable Coatings

We test our sputtering targets in a PVD application lab to ensure they meet your exact coating requirements with detailed analysis and optimization.

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    We begin with 99.95% pure niobium powder, carefully selected to maintain low impurity levels and ensure consistent material quality.

    The niobium powder is cold-pressed into a target shape under high pressure, forming a compacted structure with high initial density. This step ensures uniform material distribution, reducing defects in the final product.

    The compacted niobium is then sintered in a vacuum or controlled atmosphere furnace at high temperatures. This process fuses the powder particles together, increasing the target's density, improving mechanical strength, and ensuring a fine, uniform grain structure.

    To further improve density and eliminate internal porosity, the sintered niobium undergoes Hot Isostatic Pressing (HIP). This process applies high temperature and pressure uniformly, ensuring a fully dense, high-strength target that performs consistently in sputtering applications.

    The sintered niobium target is CNC machined to ensure accurate dimensions, tight tolerances (±0.1 mm), and a smooth surface finish (Ra 0.8–1.6 µm) for stable sputtering performance.

    A controlled heat treatment process is applied to relieve internal stresses and improve thermal stability, ensuring the target maintains its properties under high-temperature sputtering conditions.

    The target is polished and inspected to ensure a smooth, defect-free surface, which is essential for achieving consistent thin-film deposition in high-precision applications.

    Each niobium sputtering target undergoes rigorous testing to ensure high purity, optimal density, precise dimensions, and a smooth surface, guaranteeing reliable performance in sputtering applications.

    Once the targets pass all quality tests, they are carefully packaged to prevent damage and ensure safe delivery to customers worldwide.

    Mixing Machine

    Sintering Furnace

    Die Forging

    Annealing Furnace

    Cold Rolling Mill

    Straightening Machine

    CNC Deep Hole Drilling Machine

    Grinding Machine

    Wire Drawing Equipment

    Wire Cutting Machine

    Handheld XRF Analyzer

    Scanning Electron Microscope

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